Features:
1. Separate design of 4 bins with independent functions, increasing the heat dissipation space and reducing the heat dissipation interference between the hardware
2. Optimize the cooling air duct through thermal simulation and infrared thermal imaging spectrum
3. Precision integrated aluminum die-casting chassis skeleton, pursuit of lightweight and high technology
4. Fully reserved high-end water-cooling accessories installation positions, higher playability and configuration compatibility
5. Specially equipped storage bin that can accommodate 3.5 “× 8 + 2.5” × 5, easy to build massive data
6. Independent graphics card compartment can be transferred to support 3 SLI / CROSS FIRE
Specifications:
Package size | 598*565*567mm |
Product size | 538*483*493mm |
Case Material | SPCC/ AL/ Glass |
Mainboard specification | ATX/ E-ATX/ Micro-ATX/ ITX |
CPU Cooler height limited | <110mm |
Disk | 3.5inch HDD*8 |
2.5inch SSD*5 | |
Fan Positions | Front: 120mm*3(120nm/240nm/360nm water cooling); Top: 0 |
Back: 120mm*1+80mm*2; Side: 120mm*2(120nm/ 240nm water cooling) | |
I/O Ports | USB3.0*3; HD Audio I/O |
PCI Slot | 8+6 |
Single package inlcuded:
1 * Computer case ONLY ( no any other accessories included)
5 * Cooling Fan
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